Failure analysis for SCA

Bundle to apply failure analysis techniques to discover side channels and extract secret information from a device. The bundle includes:

 

  • Riscure Laser Station 
  • Mutiple microscope objectives
  • Laser Beam Splitter
  • Riscure safety box 
  • 1064 Single-mode diode laser (to be used for Optical Beam Induced Current analysis OBIC)
  • 1310 SIngle-mode diode laser (to be used for Thermal Laser Stimulation TLS)
  • 1425 Single-mode diode laser (to be used for Thermal Laser Stimulation TLS)
  • Keysight Source Measurement Unit
  • InGaAs camera & EMMI adapter & 1200nm ring light (to be used for Emmission Microscopy)
  • Infrared camera & 1050nm ring light